High density component mounting back panel for electronic equipment



FIG. 1 is a top, front perspective view of a high density componentmounting back panel for electronic equipment showing our new design;

FIG. 2 is a bottom rear perspective view thereof;

FIg. 3 is an enlarged top plan view thereof, the mounted receptacleblocks being omitted for purposes of disclosure;

FIG. 4 is an enlarged bottom plan view thereof, the mounted elementsbeing omitted for purposes of disclosure;

FIG. 5 is a side elevational view thereof;

FIG. 6 is a front elevational view thereof; and

FIG. 7 is a rear elevational view thereof.

The characteristic feature of the invention is the front and rearsurface ornamentation provided by dark areas of conductive material asshown in FIGS. 3 and 4 and the arrangement of receptacles upon the frontand rear surfaces as shown in FIGS. 1, 2, and 5-7. The contrasting darkareas on the circuit board are omitted in FIGS. 1 and 2 for ease ofillustration.

The receptacle blocks and the apertures thereon are partially shown forconvenience of illustration, it being understood that the receptaclesand apertures are continuous across the board and receptaclesrespectively as indicated by the broken lines.

The ornamental design for high density component mounting back panel forelectronic equipment as shown and described.